CBDT Press Release No: (10-Nov-14) India Signs Loan Agreements with World Bank for US$ 200 Million for Technology Centre System Programme (TCSP)

The Loan Agreement for World Bank (IBRD) financing of US$ 200 million for Technology Centre System Programme (TCSP) was signed here today between Government of India and the World Bank

The Loan Agreement was signed by Shri Tarun Bajaj, Joint Secretary, Department of Economic Affairs on behalf of the Government of India and Mr Onno Ruhl, Country Director (India) of World Bank on behalf of the World Bank. Representatives from Ministry of Micro, Small & Medium Enterprises (MSME) and the...

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