Sumco Corporation Awarded Patent for Method of Double-Side Polishing Silicon Wafer

Published date09 November 2021
Publication titleGlobal IP News (India)
The abstract released by U.S. Patent and Trademark Office states, "Provided is a method of double-side polishing a silicon wafer using a double-side polishing apparatus, the method including in succession: a first polishing step of performing double-side polishing while supplying a first polishing agent that is an alkaline aqueous solution containing abrasive grains to the polishing cloths; a polishing agent switching step of stopping the supply of the first polishing agent and starting the supply of a second polishing agent that is an alkaline aqueous solution containing a water-soluble polymer...

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