SanDisk Technologies Obtains Patent for Memory Scaling Semiconductor Device

Published date18 May 2021
Publication titleGlobal IP News (India)
The abstract released by U.S. Patent and Trademark Office states, "A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The...

To continue reading

Request your trial

VLEX uses login cookies to provide you with a better browsing experience. If you click on 'Accept' or continue browsing this site we consider that you accept our cookie policy. ACCEPT